3DINNOVATIONS 3D Printer Parts Heated Bed/Extruder Power Module Exceed Max Current 30A MKS Mosfet for RAMPS 1.4 Heating-Controller - (Size: 30A)

Description

Application: With much larger heat sink, thereby operation without active cooling at higher currents possible. Suitable for Anet A8, A6, A2; rampps; MK8; RepRap 3D printer. Uniquin Design: With unique snowflake heatsink design, it has a great cooling effect. The heat bed power module can be used in both Lerdge motherboard and other 3D printer motherboards. 30A Max Current: This high power module helps your 3D printer equipped with the Lerdge controller board become even more powerful. The module can solve the current load problem when the heated bed power is too large. With this add-on module to board lead the maximum current up to 30A. Good Protection: When using heated bed 3D printer for 12V power supply which may cause excessive current during times, with this module, it can well protect the connectors on the controller board from burning. Hot bed high-power extension module: 3D Printer High Power Heatbed Module MOS Tube High Current Load Power Expansion. Unique snowflake heat sink design, heat dissipation is more strong, solve the bed with heat power is too large, the current load problem. This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this). Note: This module under the normal heat dissipation, the measured when I (Max) = 30A can stable long-term work, in use process, current do not more than 30A. Important Note: Please connect another high power module when Heated Bed power is more than 150W. Package Includes: 1 pc Heated Bed Power Module and cables as shown in first product image